本篇内容主要讲解“OpenSCAD怎么实现3D打印NodeMCU外壳”,感兴趣的朋友不妨来看看。本文介绍的方法操作简单快捷,实用性强。下面就让小编来带大家学习“OpenSCAD怎么实现3D打印NodeMCU外壳”吧!
OpenSCAD的原始模型文件如下,可以自行修改后在3D打印机上输出。
//NodeMCU智能设备,盒子,防雨淋型(垂直安装)
//Author:openthings@163.com,
//copyright 2015-2025.
//打印时注意比例变化,并且旋转向上。
//避免上部打印时无支撑塌陷。
//盖子单独打印,或放为两个模型。
//常量定义
athick=0.5; //盖子厚度
bthick=0.10; //盒壁厚度
bwidth=4.0; //内径净宽
bhight=1.5; //内径净高
blong_inter=5.5;//内径净长
//外径长度=底厚+内径+挡格+盖子厚度
blong=bthick+blong_inter+bthick+athick;
//文字或图标标识
//translate([-2,0,0])
//scale([1, 1, 0.1])
// surface(file = "smiley.png", center = true);
//======================================
//盒子体,采用挖空切割方式造型。
difference() {
//外盒
translate([0,0,0])
{ color([0.8,0.8,0.8])
cube([blong,bwidth+bthick*2,
bhight+bthick*2]);
}
//内盒,挖空。
translate([bthick,bthick,bthick])
{ color([0.2,0.8,0.8])
cube([blong+1,bwidth,bhight]);
}
//底部,凹陷标识,可贴标签。
translate([blong-2,1.8,bhight+bthick+0.08])
{ color([0.6,0.6,0.6])
cube([1.5,bwidth*0.5,0.1]);
}
}
//底部加强,在内部形成边角挡格。
translate([bthick,bthick,bthick])
{ color([0.2,0.5,0.2])
cube([bthick,bwidth,bthick]);
}
translate([bthick,bthick,bhight])
{ color([0.2,0.5,0.2])
cube([bthick,bwidth,bthick]);
}
translate([bthick,bthick,bthick])
{ color([0.2,0.5,0.2])
cube([bthick,bthick,bhight]);
}
translate([bthick,bwidth,bthick])
{ color([0.2,0.5,0.2])
cube([bthick,bthick,bhight]);
}
//盖子挡格。
translate([blong-athick,bthick,bthick])
{ color([0.2,0.5,0.2])
cube([bthick,bwidth,bthick]);
}
translate([blong-athick,bthick,bhight])
{ color([0.2,0.5,0.2])
cube([bthick,bwidth,bthick]);
}
//======================================
//盖子,单独打印。嵌入盒子内部,注意留公差。
translate([5.75,0.0,0]){
//translate([0,0,2]){
difference() {
//盖子,挖空。
translate([0,bthick,bthick])
{ color([0.5,0.5,0.5])
cube([athick-0.05,bwidth,bhight]);
}
translate([0.2,bthick*2,bthick*2])
{ color([0.6,0.3,0.8])
cube([athick+1,bwidth-bthick*2,
bhight-bthick*2]);
}
//通风口,挖空。================
//左侧出风口
translate([-0.1,0.5,0.4])
{ color([1,0.8,0.8])
cube([0.8,0.3,0.9]);
}
translate([-0.1,1,0.4])
{ color([1,0.8,0.8])
cube([0.8,0.3,0.9]);
}
//右侧进风口
translate([-0.1,3,0.4])
{ color([1,0.8,0.8])
cube([0.8,0.3,0.9]);
}
translate([-0.1,3.5,0.4])
{ color([1,0.8,0.8])
cube([0.8,0.3,0.9]);
}
//USB接口,挖空。
translate([-0.1,1.75,1.0])
{ color([1,0.8,0.8])
cube([0.8,0.8,0.3]);
}
}
}
到此,相信大家对“OpenSCAD怎么实现3D打印NodeMCU外壳”有了更深的了解,不妨来实际操作一番吧!这里是亿速云网站,更多相关内容可以进入相关频道进行查询,关注我们,继续学习!
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原文链接:https://my.oschina.net/u/2306127/blog/380089